high density XPS foam board | XPS Extruded Polystyrene Foam Board |XPS Insulation Board manufacturer from China Feininger(Nanjing) Energy Saving Technology Co.,Ltd

high density XPS foam board | XPS Extruded Polystyrene Foam Board |XPS Insulation Board

Price:	80.0 USD
Payment Terms:	T/T,L/C
Place of Origin:	Jiangsu, China (Mainland)


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Product Detail

Means of Transport: Ocean,Land,Air

Packing: polybag

Material: Others

Apparent Density: 28-55 kg/m3

Highest Working Temperature: +75 Celsius

Width: 600mm/900mm/1200mm or per r...

Color: White/Light yellow / Blue /...

Production Capacity: 10000cubic meters per month

Delivery Date: 20days

Brand Name: feininger

Heat Conductivity: ≤0.030W/m.K

Thickness: 20-120mm

Length: 1200mm-3000mm, custom made

XPS foam board is an extruded polystyrene insulation manufactured through a plastic extrusion process.

XPS Insulation Board Production Process: Polystyrene Granule, Talcum Powder, Master batch, Blowing Agent are mixed and melted in Extruder. The melt material will be extruded out of Slot Die, then through Calibrator, we reach a panel shape. After cooling, cutting, edge trimming, we will pack in water-proof plastic bag. This is the XPS Foam Board in market.

Feininger XPS Foam Board:

1.Stable performance and anti-aging: The extruded polystyrene (XPS) insulation boards can be used 35-50 years.

2.Resistance to compression: compared with other thermal insulation material(200Kpa for EPS), it has better compressive strength(around 300Kpa), which make it the ideal solution for heavy domestic or industrial loads

3.Water resistance: Polyfoam is almost 100% closed cell and as such is unaffected by moisture

4.Lightweight: volume optimization and easy to handle

5.Resistance to deformation

6.Resistance to impact

7.Versatile: the closed cell structure and density of Polyfoam allow specific edge details and surface finishes to be cut into the boards to make them as fit for the job as possible. Moreover, Polyfoam can be cut into almost any shape
100% ozone friendly

8.Recyclable: Polyfoam can be 100% recycled

9.XPS Insulation Board Production Process: Polystyrene Granule, Talcum Powder, Master batch, Blowing Agent are mixed and melted in Extruder. The melt material will be extruded out of Slot Die, then through Calibrator, we reach a panel shape. After cooling, cutting, edge trimming, we will pack in water-proof plastic bag. This is the XPS Foam Board in market.

10.Properties:Heat Insulation, Water-proof, Noise-elimination, Anti-corrosion, Anti-aging, Light-weight, High Compressive Strength and Low Moisture permeability.

11.Application: Wall Insulation, Inverted Roof Insulation, Floor Insulation, Sanwich Panel, Steel Plate Sandwich Panel, PVC Sandwich Panel, Cold Storage Insulation, Refrigeratory, Airport Ground, High speed Rail-way Base.

12.Specification: Thickness: 20-120mm Width: 600mm, 900mm, 1200mm Length:1200mm, 2400mm, 3000mm or your option Color: light-yellow, blue, green, pink Loading: 65 M3/40'HQ

Technical Data Sheet:

Technical Data Executive Standard: GB/T 10801.1-2002
Item	Unit	Property Index
With Skins	Without Skins
X150	X200	X250	X300	X350	X400	X450	X500	W200	W300
Compressive Strength	KPA	≥150	≥200	≥250	≥300	≥350	≥400	≥450	≥500	≥200	≥300
Water Absorption, dipped in water for 96h	%(by volume)	≤1.5	≤1.0	≤2.0	≤1.5
MoisturePermeability, 23°C±1°C,RH 50%±5%	Ng/(m.s.Pa)	≤3.5	≤3.0	≤2.0	≤3.5	≤3.0
Heat Insulation	Heat Resistance Thickness25mm 10°C 25°C	(m2·K)/W	≥0.89 ≥0.83	≥0.93 ≥0.86	≥0.86 ≥0.86	≥0.86 ≥0.86
Heat Conductivity Average Temp. 10°C 25°C	W/(m·K)	≤0.028 ≤0.030	≤0.027 ≤0.029	≤0.030 ≤0.032	≤0.030 ≤0.032
Dimensional Stability 70°C±2°C, 48h	%	≤2.0	≤1.5	≤1.0	≤2.0	≤1.5

Technical Data Executive Standard: GB/T 10801.1-2002

Item

Unit

Property Index

With Skins

Without Skins

X150

X200

X250

X300

X350

X400

X450

X500

W200

W300

Compressive Strength

KPA

≥150

≥200

≥250

≥300

≥350

≥400

≥450

≥500

≥200

≥300

Water Absorption,

dipped in water for 96h

%(by volume)

≤1.5

≤1.0

≤2.0

≤1.5

MoisturePermeability, 23°C±1°C,RH 50%±5%

Ng/(m.s.Pa)

≤3.5

≤3.0

≤2.0

≤3.5

≤3.0

Heat

Insulation

Heat Resistance

Thickness25mm

10°C

25°C

(m2·K)/W

≥0.89

≥0.83

≥0.93

≥0.86

Heat Conductivity

Average Temp.

10°C

25°C

W/(m·K)

≤0.028

≤0.030

≤0.027

≤0.029

≤0.030

≤0.032

≤0.030

≤0.032

Dimensional Stability 70°C±2°C, 48h

≤2.0

≤1.5

≤1.0

≤2.0

≤1.5

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